DLC薄膜过渡层制备的一些资料总结

Eddy 发布于2009-11-2 16:54:42 分类: 材料科学 已浏览loading 网友评论0条 我要评论

1、参考文献:射频溅射Si膜的微结构与光学性质研究(宋学萍)

薄膜的制备
实验用JGP560Ⅰ型超高真空磁控溅射仪制备不同厚度的Si薄膜,膜厚由溅射时间控制。Si靶的纯度为99. 99%。镀膜前,所有用于制备Si膜的基片经过超声波清洗处理,真空烘干后置于干燥缸内备用。
当真空室本底真空度达到6. 0 ×10 - 4 Pa后,充入高纯Ar (99. 999% )作为溅射气体。溅射时工作气压为0. 7 Pa,溅射功率为60W,溅射时间分别为20、30、40、50和60 min。衬底温度为300 ℃。
 
2、参考文献:喇曼光谱研究硅烷体积分数对Si 薄膜结构影响(张乾)
薄膜样品在PECVD系统中制备,真空室的本底真空为10 - 4 Pa,沉积气压为100 Pa,上下电极板间距为4 cm,射频电源激发频率为13156 MHz。利用SiH4 和H2 作为反应气体,由流量显示仪控制SiH4和H2流量,通过调节硅烷体积分数(H稀释比) , 使SiH4在辉光放电下发生分解并最终沉积在普通玻璃衬底上。
 
3、参考文献:A comparative study on SiC thin films grown on both uncatalyzed and Ni catalyzed (催化)Si(100) substrates by thermal MOCVD using single molecular precursors
自制设备来制取SiC thin films
 
4、参考文献:Electrochemical properties of Si thin film prepared by pulsed laser(脉冲激光) deposition for lithium ion micro-batteries
利用excimer laser(准分子激光)轰击硅靶,沉积到基体上。可得到Strong adhesion and hight density of the thin film.具体实验参数见原文。
 
5、参考文献:Improvement of electrochemical performance of Si thin film anode
by rare-earth La PIII technique
利用磁控溅射的办法在Cu的表面沉积Si膜。实验具体参数详见原文。
 
6、参考文献:Properties of amorphous Si thin film anodes prepared by pulsed laser deposition
脉冲激光沉积Si膜

a-       Si thin films were grown on stainless steel and Si substrates by PLD at a pressure about 10


5 mTorr at room temperature. A Si(0 0 1) wafer was used as the target. The target–substrate distance was kept at 40 mm and the deposition time was 30 min. A Lambda Physik KrF excimer laser beam (248 nm, 150–160 mJ/pulse) was used in the deposition with a repetition frequency of 10 Hz. LiCoO2 thin films were also grown on SS and Si substrates by PLD but in an oxygen partial pressure of 100 mTorr at a substrate temperature of 600 8C. The films deposited on SS substrates (0.785 cm2) were used for the measurements of microstructure and electrochemical properties, while films on Si substrates were used for estimation of thin film thickness and growth rate.

7、参考文献:SiC film formation from fluorosilane gas by plasma CVD
SiC films were prepared using a mixture of SiF4, H2, CH4 and Ar by plasma CVD.

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